Ni LED jiralanw bɛ kɛ ka kɛɲɛ ni i yɛrɛ sago ye, fɛn sugandili bɛ nɔ bila fɛn dilannen ka baarakɛcogo la, a muɲuli la, ani a jiracogo laban na. K’a ta yeelenbɔlan-puce la ka taa a bila pakew dilanni na, k’a ta PCB substrat la ka taa a bila so jɔcogo la, fɛnw latigɛcogo taabolo bɛɛ la, o bɛ jateminɛ bɛɛ kɛ ka da baarakɛcogo kɛcogo kan, sigida cogoyaw kan, ani baarakɛnafolo wajibiyalenw kan. Nin barokun bɛ fɛn kolomaw ka fɛnw cogoya sɛgɛsɛgɛ walasa ka baarakɛlaw ka bilasirali di magow kan minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye.
LED Lamp Bead Material: Basi min bɛ yeelen cogoya jira
LED lanpan biɲɛw ye yeelenbɔlan koloma-bɔlan ye, wa u fɛnw bɛ nɔ bila yeelen na, kulɛriw lasegincogo la, ani u si hakɛ la k’a ɲɛsin u yɛrɛ ma. Sisan, furajiba in bɛ baara kɛ ni nitiridi galiyɔmu (GaN)-puw ye minnu bɛ kɛ ni epoyi walima silikɔni resin ye. Ni baarakɛminɛnw ye minnu ka bon-(i n’a fɔ kɛnɛma piblisite ekranw), nɛgɛ-lanpan biɲɛw de ka fisa ka da u ka funteni bɔli kan ka tɛmɛ nɛgɛdaga kan, o bɛ yeelen toli dɔgɔya. Faan wɛrɛ fɛ, so kɔnɔ fine-pitch jiralanw ka teli ka baara kɛ ni EMC (epoxy molding compound) encapsulation ye, min bɛ baara kɛ ni fɛnw ye minnu bɛ se ka funteni- kosɛbɛ walasa ka pixel pitch control sabatilen sɔrɔ. Mako kɛrɛnkɛrɛnnenw kama, i n’a fɔ ultraviolet walima infrarouge baarakɛcogo, lanpan biɲɛ kɛrɛnkɛrɛnnenw ni AlGaInP walima InGaN-based pucew de ka kan.
PCB Substrate: Kuran baarakɛcogo ni funteni bɔli balansi
Fɛn minnu bɛ sugandi ka ɲɛsin sɛrɛkili sɛbɛnnenw (PCB) ma, olu ka kan ka kuran sɛnɛcogo ni funteni sɛnɛcogo bɛn ɲɔgɔn ma. Fɛn minnu bɛ kɛ ka caya, olu ka teli ka baara kɛ ni FR-4 fibreglasi pankurunw ye (tasuma kunbɛnni hakɛ UL94-V0), minnu bɛnnen don so kɔnɔ sigidaw ma. Nka. U ka nɛgɛdagaw bɛ funteni tiɲɛ joona, o bɛ sigida funteni caya kojugu ani pixel dɛsɛ bali. Porozɛ minnu bɛ sanfɛ, olu yɛrɛ bɛ baara kɛ ni seramiki fɛnw ye (i n’a fɔ nitiridi aluminiyɔmu, AlN). Hali n’u sɔngɔ ka gɛlɛn, o substratw bɛ se ka kɛ sababu ye ka sɛrɛkili labɛncogo tigitigiw kɛ fo ka se milimɛtɛrɛ hakɛ ma.
Lamini ni lakanani sigicogo: Lamini ladamuni garanti jɔnjɔn
Kɛnɛmafɛnw minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye, olu ka kan ka kɛ ni lakanani hakɛ barikama ye (IP65 walima ka tɛmɛ o kan). A ka c’a la, dakunw bɛ dilan ni die-aluminiyɔmu walima fibre carbone composite fɛnw ye. Fɔlɔ bɛ baara kɛ ni fɛn dilanni fɛɛrɛ jɛlen ye walasa ka jɔli fanga sabati k’a sɔrɔ a bɛ funteni bɔli ɲuman fana di. Nin laban in ka nɔgɔn, wa a bɛnnen don jagokɛyɔrɔw ma minnu bɛ to ka lajɛ ani ka u fara ɲɔgɔn kan. Surface furakɛli ko la, UV-resistant finiw ani kɔgɔ fiyɛli sɔgɔli lakanani nafa ka bon. Kɛrɛnkɛrɛnnenya la, kɔgɔjida la walima sanji bɛ yɔrɔ minnu na, a ka ɲi ka lakana fura fila-la ka kɛ nɛgɛ galvanizelen ni nano-fiyɛli dacogo ye.
Sofɛrɛ ICw ni kabaliw: Siginidenw cicogo dogolen
Sofɛrɛ ka ciriw (IC) ka pakew bɛ nɔ bila jaabi teliya la ani a sabatili la. Misali la, COB (Chip on Board) ka pakew jɛlenw bɛ puce siri k’a ɲɛsin epoyi resin ma, o bɛ dɔ bɔ solder joint dɛsɛli hakɛ la; laadala SMD pakew bɛ u jigi da FR-4 substratw ka arc control sekow kan minnu ka ɲi kosɛbɛ. Se ni taamasiyɛn kabɔriw ka kan ka baara kɛ ni nɛgɛbere ye min tɛ oksizɛni{5}}la, ni a lakanani jɔcogo ye min bɛ kɛ ni fɛn fila ye. Kɛnɛma porozɛw kama, PVC walima silikoni lastikuw kɛnɛma dacogo min bɛ se ka waati kɛlɛ, o ka ɲi walasa ka insulasi tiɲɛni bali min bɛ sɔrɔ UV kɔrɔya fɛ.
Kuncɛli: Customization ka kan ka scenario wajibiyalenw dafa
Material selection isn't a matter of single parameters; it's a systematic process based on factors such as brightness requirements (e.g., >8000 nits kɛnɛma vs.<1000 nits indoors), environmental harshness (temperature, humidity, dust, vibration), and maintenance cycles. We recommend that users communicate in depth with manufacturers during the initial stages of customization, using methods such as finite element analysis (FEA) to simulate thermal distribution and salt spray testing to verify corrosion resistance, to ensure that the final solution achieves optimal performance while maintaining controllable costs.
